• Boost throughput and slash cycle times with our Multi-DUT Test Sockets, engineered for simultaneously testing multiple ICs in automated environments. Ideal for wafer probing, final test, and production validation, these sockets support parallel testing of 4, 8, or 16+ devices --dramatically improving efficiency for memory, logic, and RF chips.

• High-Density Parallel Testing - Validate multiple dies/units in a single insertion
• Probe & Elastomer-Compatible - Supports vertical probes, pogo pins, and anisotropic conductive film (ACF) interfaces
• Optimized Signal Integrity - Low crosstalk and impedance-matched pathways (<0.5Ω variation)
• Handler/Prober-Ready - Works with Teradyne, Advantest, and STS testers

Whether for NAND flash, automotive MCUs, or 5G RF modules, our Multi-DUT sockets ensure repeatable, high-force contact while reducing test costs per unit. Request a custom configuration --our engineers can tailor layouts to your device array.

• Superior Durability - Built for high-cycle testing with robust materials that withstand thousands of insertions
• Broad Compatibility - Supports BGA, QFN, SOP, and other IC packages
• Precision Contact Technology - Low-resistance spring probes or pogo pins for reliable electrical connections
• Custom Configurations - Tailored test fixtures for unique IC designs and testing requirements
• Thermal & High-Frequency Options - Specialized sockets for burn-in, high-temp, and RF testing

For more options or custom requests, see the details below or get in touch with our engineers.

Whether you're validating prototypes, programming ICs, or running high-volume production tests, our custom test sockets ensure accuracy and repeatability. Engineered for challenging environments, our sockets feature robust mechanical designs to prevent warping under thermal stress while maintaining stable contact resistance. Compatible with automated handlers and testers, they streamline your validation process while cutting downtime.