Revolutionize your embedded memory validation with our zero-footprint BGA221 eMCP test socket. The precision-engineered interposer matches the exact chip footprint, enabling direct solder mounting without PCB modifications.

• Instant deployment with no PCB milling requirements
• Two configurations available:
  • F-Series: Standard contact solution
  • F1-Series: Integrated test points for signal analysis
• Supports LPDDR+NAND stacked packages
• Gold-plated contacts ensure > 10,000 test cycles
• Compact 2.5mm profile ideal for dense boards

Memory manufacturers, smartphone repair centers, embedded system developers

The image is for reference only. All items listed below include zero-footprint sockets. Please contact us for details

Solder interposer -> test board

Attach test socket

Insert chip & lock cover