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EMMC Test Socket BGA100 BGA153 Socket Zero Footprint Design No PCB Modification Needed

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Sireda Technology Co., Ltd.

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EMMC Test Socket BGA100 BGA153 Socket Zero Footprint Design No PCB Modification Needed

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Brand Name :	Sireda
Model Number :	Open Top
Certification :	ISO9001
Price :	Get Quote

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EMMC Test Socket BGA100 BGA153 Socket Zero Footprint Design No PCB Modification Needed

High-Performance Zero-Footprint Sockets for eMMC (BGA100 & BGA153) Testing

Our ultra-compact eMMC test sockets provide a fast, reliable testing solution with a direct-solder design --requiring no PCB modifications for hassle-free validation of embedded memory chips.

Key Features:

Perfect Chip-Sized Interposer - Matches BGA100 & BGA153 footprints precisely
No Need for PCB Cutouts - Solder directly onto test boards for instant use
Two Versions for Different Testing Needs:
- F Series (Standard) - Simplified contact-only testing
- F1 Series (Enhanced) - Test points for signal and power analysis (great for debugging)
High-Speed Compatibility - Supports fast eMMC 5.1 & UFS interface validation
Durable & Reliable - Over 10,000 mating cycles

Ideal For:

Manufacturers conducting production testing on eMMC chips
R & D Teams validating board-level eMMC performance
Repair & Debugging labs analyzing signal integrity

eMMC BGA153 eMMC BGA100

The image is for reference only. All items listed below include zero-footprint sockets. Please contact us for details

Ufs	eMCP	eMMC	DDR	LPDDR	NAND
BGA254	BGA221	BGA153	BGA78	BGA200	BGA132
BGA153		BGA162	BGA96	BGA315	BGA136
		BGA169		BGA152
		BGA100		BGA154
		BGA254

F vs F1 Solution Comparison

Installation Steps:

Solder interposer -> test board
Attach test socket
Insert chip & lock cover

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